AMB copper-clad ceramic carrier board

发布日期：2026-03-26 15:36　浏览次数：

Product Introduction
AMB copper-clad ceramic carrier board is a technological advancement of DBC copper-clad ceramic carrier board. It achieves bonding by utilizing a small amount of active elements contained in the brazing material to chemically react with the ceramic substrate at high temperatures, resulting in better overall product performance. Currently, it is mainly applied in new energy vehicles, rail transit, new energy power generation, 5G communication, and other fields.

Product Features
Compared to DBC copper-clad ceramic carrier boards, it has higher bonding strength
·Ceramic substrates made of AlN and Si3N4 materials are used, featuring high thermal conductivity and low thermal expansion coefficient
The reliability of the product is better

Product specification introduction

substrate thickness	Copper foil thickness 0.2mm	Copper foil thickness 0.25mm	Copper foil thickness 0.3mm	Copper foil thickness 0.4mm	Copper foil thickness 0.5mm	Copper foil thickness 0.8mm
0.25mm	Si3N4 AlN	Si3N4 AlN	Si3N4	Si3N4	Si3N4	Si3N4
0.32mm	Si3N4 AlN	Si3N4 AlN	Si3N4 AlN	Si3N4	Si3N4	Si3N4
0.38mm	Si3N4 AlN	Si3N4 AlN	Si3N4 AlN	Si3N4	Si3N4	Si3N4
0.5mm	AlN	AlN	AlN	AlN	AlN	/
0.635mm	AlN	AlN	AlN	AlN	AlN	/

Product performance indicators

project	unit	AlN	Si3N4
Maximum size	mm	138*190	138*190
Maximum available size	mm	130*180	130*80
Overall dimensional tolerance	mm	±0.1	±0.1
Product thickness tolerance	/	±7%	±7%
line width, line spacing	mm	≥0.5	≥0.5
warp	/	≤4‰	≤4‰
peel strength	N/mm	＞10	＞10
solderability	/	＞95	＞95
thermal cycle count	(-55℃-150℃) times	＞65	＞2000
Ra of copper surface	μm	≤1.5	≤1.5
shear strength	(300μm aluminum wire) gf	＞1000	＞1000
Application temperature range	℃	（-55，650）	（-55，650）
surface treatment	bare copper Anti-oxidation treatment Thickness of surface nickel plating: 1-7μm Surface nickel-gold plating thickness: Au 0.01-0.1μm, Ni 1-7μm Thickness of silver plating on the surface: 0.1-0.6μm solder resist ink

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Copper-clad ceramic carrier bo

AMB copper-clad ceramic carrier board