Thermal sink ceramic carrier board
发布日期：2026-03-26 15:35 浏览次数：
Heat sink
Product Introduction
1. Ceramic substrate: aluminum nitride/silicon carbide/diamond
2. AuSn thickness: 3μm
3. The AuSn ratio can be adjusted slightly
4. Ra < 0.2μm, flatness < 5μm
5. Edge burr < 10μm
Product Features:
1. Capable of achieving ultra-thin substrate finished products (0.15mm)
2. Each plating layer is uniform and exhibits strong adhesion
3. Excellent control of plating thickness tolerance
4. High surface smoothness and flatness
5. The manufacturing process capability can accommodate high requirements for customized products
Application scenarios: semiconductors, lasers, laser pumping, microwave and radio frequency, etc
