Application field: heat dissipation substrate, power electronic circuit substrate (special shape substrate can be made according to demand)
Product performance:
☞ it has more than twice the bending strength compared with alumina substrate or aluminum nitride substrate.
☞ it has more than three times the thermal conductivity compared with alumina substrate or ZTA substrate.
☞ high electrical insulation
☞ the coefficient of thermal expansion is similar to that of silicon
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