Micro-TEC 
Product Introduction 
1. Ceramic substrate: AlN/Al2O3 
2. Minimum line width and spacing: 50μm 
3. Copper layer thickness: ≤35μm (±20%) 
4. Total thickness deviation ≤15μm 
5. Surface treatment: Ni, Ni/Au, Ni/Pd/Au

Product Features: 
1. The plating has strong adhesion and a smooth and flat surface 
2. The thickness deviation of copper is small, with a thickness deviation of ≤7μm for a copper thickness of 35μm 
3. Small deviation in line width and spacing of graphic lines 
4. The surface treatment is good, suitable for subsequent binding 
5. The manufacturing process capability can accommodate customized high-demand products 
Application scenarios: temperature control components, heat dissipation components, thermoelectric power generation, optical communication, etc