Copper-clad ceramic carrier bo
AMB copper-clad ceramic carrier board
作者: admin
发表日期::2026-03-26 15:36:11
详细介绍:
Product Introduction 
AMB copper-clad ceramic carrier board is a technological advancement of DBC copper-clad ceramic carrier board. It achieves bonding by utilizing a small amount of active elements contained in the brazing material to chemically react with the ceramic substrate at high temperatures, resulting in better overall product performance. Currently, it is mainly applied in new energy vehicles, rail transit, new energy power generation, 5G communication, and other fields.


Product Features 
Compared to DBC copper-clad ceramic carrier boards, it has higher bonding strength 
·Ceramic substrates made of AlN and Si3N4 materials are used, featuring high thermal conductivity and low thermal expansion coefficient 
The reliability of the product is better

Product specification introduction

substrate thickness

Copper foil thickness 0.2mm

Copper foil thickness 0.25mm

Copper foil thickness 0.3mm

Copper foil thickness 0.4mm

Copper foil thickness 0.5mm

Copper foil thickness 0.8mm

0.25mm

Si3N4

AlN

Si3N4

AlN

Si3N4

 

Si3N4

 

Si3N4

Si3N4

0.32mm

Si3N4

AlN

Si3N4

AlN

Si3N4

AlN

 

Si3N4

 

Si3N4

Si3N4

0.38mm

Si3N4

AlN

Si3N4

AlN

Si3N4

AlN

 

Si3N4

 

Si3N4

Si3N4

0.5mm

AlN

AlN

AlN

AlN

AlN

/

0.635mm

AlN

AlN

AlN

AlN

AlN

/


Product performance indicators

project

unit

AlN

Si3N4

Maximum size

mm

138*190

138*190

Maximum available size

mm

130*180

130*80

Overall dimensional tolerance

mm

±0.1

±0.1

Product thickness tolerance

/

±7%

±7%

line width, line spacing

mm

≥0.5

≥0.5

warp

/

≤4‰

≤4‰

peel strength

N/mm

10

10

solderability

/

95

95

thermal cycle count

(-55℃-150℃) times

65

2000

Ra of copper surface

μm

≤1.5

≤1.5

shear strength

(300μm aluminum wire) gf

1000

1000

Application temperature range

-55,650)

-55,650)

surface treatment

bare copper 
Anti-oxidation treatment 
Thickness of surface nickel plating: 1-7μm 
Surface nickel-gold plating thickness: Au 0.01-0.1μm, Ni 1-7μm 
Thickness of silver plating on the surface: 0.1-0.6μm 
solder resist ink




上一篇:没有了
Hotline
15064141118
18953321267
QQ
wechat
Back to top