Copper-clad ceramic carrier bo
DBC copper-clad ceramic carrier board
作者: admin
发表日期::2026-03-26 15:44:22
详细介绍:
Product Introduction 
DBC copper-clad ceramic carrier board is a specialized circuit board for high-power electronic products. Due to its unique performance advantages, it is widely used in fields such as high-speed rail vehicles, new energy vehicles, new energy power generation, and household appliances. 
Our company offers a diverse range of DBC (Double-Sided Copper-Clad Ceramic) carrier boards, utilizing substrate materials such as Al2O3, AlN, and ZTA, paired with copper layers of varying thicknesses. Furthermore, our supporting testing laboratory is equipped with advanced instruments such as laser scanning confocal microscopes, ultrasonic scanners, anime imaging measuring instruments, and peeling testers, ensuring the high quality of every product.

Product Features 
High mechanical strength, high thermal conductivity, and high current-carrying capacity 
·High thermal shock resistance and good stability at high temperatures 
·High precision in circuit layout, with multiple surface treatment processes 

Product specification introduction

substrate thickness

Copper foil thickness 0.1mm

Copper foil thickness 0.2mm

Copper foil thickness 0.25mm

Copper foil thickness 0.3mm

Copper foil thickness 0.4mm

0.25mm

Al2O3

AlN

ZTA

Al2O3

AlN

ZTA

Al2O3

AlN

ZTA

 

ZTA

 

/

0.32mm

Al2O3

ZTA

Al2O3

ZTA

Al2O3

ZTA

Al2O3

ZTA

ZTA

0.38mm

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

/

0.5mm

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

0.635mm

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

0.76mm

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

1.0mm

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN

Al2O3

AlN



Product performance indicators

project

unit

Al2O3

AlN

ZTA

Maximum size

mm

138*190

138*190

138*190

Maximum available size

mm

130*180

130*180

130*80

Overall dimensional tolerance

mm

±0.1

±0.1

±0.1

Product thickness tolerance

/

±7%

±7%

±7%

line width, line spacing

mm

≥0.5

≥0.5

≥0.5

warp

/

≤4‰

≤4‰

≤4‰

peel strength

N/mm

5.0

4.0

5

solderability

/

95

95

95

thermal cycle count

(-55℃-150℃) times

45

35

110

Ra of copper surface

μm

≤3

≤3

≤3

shear strength

(300μm aluminum wire) gf

1000

1000

1000

Application temperature range

-55,850)

-55,850)

-55,850)

hydrogen embrittlement temperature

400

400

400

surface treatment

bare copper 
Anti-oxidation treatment 
Thickness of surface nickel plating: 1-7μm 
Thickness of surface nickel-gold plating: AU 0.075-0.1μm, Ni 1-7μm 
Surface silver plating thickness: 0.1-0.6μm 
solder resist ink







下一篇:没有了
Hotline
15064141118
18953321267
QQ
wechat
Back to top